"US awards $458m to SK Hynix for chip packaging plant" was originally created and published by Verdict, a GlobalData owned ...

Nvidia supplier SK Hynix (OTCPK:HXSCF) has won up to $458M in direct funding as part of the U.S. CHIPs Act to build a robust ...

The U.S. Commerce Department on Thursday finalized an award to SK Hynix of up to $458 million in government grants to help ...

As competition in the high bandwidth memory (HBM) market escalates, SK Hynix is on track to begin mass production of its ...

SK hynix rumored to deliver huge HBM memory order to Broadcom in 2025: which is building new AI chips for Google, Meta, and ...

The US government has recently finalized the subsidy amounts for SK Hynix and Samsung Electronics (Samsung), with the two ...

Earnings forecasts for South Korea's two largest chipmakers, Samsung Electronics and SK hynix, for the fourth quarter have ...

This is expected to create about 1,000 new jobs and hundreds of construction jobs and establish a research hub in Indiana ...

President Joe Biden's administration has finalized an award of up to $458 million for SK hynix, officials said Thursday, ...

Read about the $458M federal funding support for South Korean company SK Hynix’s upcoming advanced memory packaging plant in ...

SK Hynix has secured a $458 million grant from the U.S. Commerce Department to fund an AI chip packaging plant in Indiana.

Purdue President Mung Chaing announced the historic $3.7 billion SK hynix partnership in April. The U.S. Department of Commerce announced $458 million in funding through the CHIPS Act for the ...