Semiconductor Packaging News6d
DENSO and onsemi Collaborate for a Strengthened Relationship
DENSO CORPORATION and onsemi announced that they are strengthening their long-term relationship to support the procurement of autonomous driving (AD) and advanced ... Semiconductor Packaging News is ...
Semiconductor Packaging News6d
sureCore teams with Sarcina to package cryo chips
Further to sureCore's recent announcement about its launch of a range of cryogenic IP following the successful evaluation of test chips in both 180 nm and 22nm process nodes, ...
Semiconductor Packaging News8d
Aehr Test Systems Secures Initial $10 Million in Orders for Production
We search for industry news so you don't need to. Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Semiconductor Packaging News8d
Silicon photics: accelerating growth in the race for high-speed optical interconnects
Silicon photonics continues to evolve rapidly, with its diverse applications signaling significant opportunities ahead. Over the next decade, key players are expected to emerge ... Semiconductor ...
Semiconductor Packaging News6d
Good overall result and revenue growth for the ZEISS Group
ZEISS Group revenue increased to just under 11 billion euros (10.894 billion euros), (up 8% on the prior year) – EBIT 1,444 million euros (prior year: 1,686 million euros ... ZEISS partners with ...
Semiconductor Packaging News8d
Astute Group and Wise-integration Announce EMEA Distribution Partnership
Astute Group and Wise-integration announced a strategic distribution partnership covering Europe, the Middle East and Africa (EMEA). Wise-integration's WiseGan® family ... Semiconductor Packaging News ...
Semiconductor Packaging News6d
SEMICON Korea 2025 to Spotlight Edge Technologies Shaping the AI Era
SEMICON Korea 2025 will take place Feb. 19-21 in Seoul at the COEX offering a comprehensive look into AI-driven technological advancements and edge technologies ... SEMICON Japan opens at Tokyo Big ...
Semiconductor Packaging News8d
ZEISS and Mindpeak partner to advance Multiplex Immunofluorescence solutions
ZEISS Group revenue increased to just under 11 billion euros (10.894 billion euros), (up 8% on the prior year) – EBIT 1,444 million euros (prior year: 1,686 million euros ... ZEISS partners with ...
Semiconductor Packaging News8d
ZEISS and HÜBNER bring advanced functionality to bus and train windows
With its holographic display technology, integrated into the window systems of buses and trains, ZEISS now offers greater comfort on public transit journeys. The ZEISS ... Carl Zeiss Meditec generated ...
Semiconductor Packaging News9d
CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
CEA-Leti research engineers have demonstrated for the first time a scalable hafnia-zirconia-based ferroelectric capacitor platform integrated into the back-end-of-line (BEOL) ...
Semiconductor Packaging News9d
Global Trade Restrictions on Semiconductor Materials Intensify: TECHCET Offers Critical Market Insights
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Semiconductor Packaging News9d
ACM Research Strengthens Atomic Layer Deposition Portfolio
ACM Research, Inc. announced the qualification of its Ultra Fn A Plasma-Enhanced Atomic Layer Deposition (PEALD) Furnace tool. The tool has achieved process qualification ...